ASUS P11C-M/10G-2T Intel C242 LGA 1151 (Socket H4) Mini-ITX

ASUS P11C-M/10G-2T. Processor manufacturer: Intel, Processor socket: LGA 1151 (Socket H4), Compatible processor series: Intel® Xeon®, Intel Xeon E. Supported memory types: DDR4-SDRAM, Maximum internal memory: 64 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III, Supported storage drive types: HDD & SSD, RAID levels: 0, 1, 5, 10. Ethernet interface type: Gigabit Ethernet, LAN controller: Intel® I210-AT. Component for: PC, Motherboard form factor: Mini-ITX, Motherboard chipset: Intel C242

Intel Xeon E micro-ATX server motherboard with rack-optimized design and high speed 10G networking Micro-ATX compact server board with multiple expandability options P11C-M/10G-2T is a server motherboard based on the Intel® Xeon® E platform and Intel® C242 chipset offering dual server-class Intel® Ethernet and flexible expandability with dual M.2, six SATA 6G, two PCIe. The 9.6” x 9.6” micro ATX form factor can be easily integrated in short-depth chassis to greatly increase rack compute density. The layout is rack-optimized placement where the CPU and memory are placed in a parallel arrangement directly behind the fan inlet to promote maximum cooling for excellent thermal efficiency. Dual M.2 for up to 32Gbps performance speed NVMe support P11C-M/10G-2T support max 5NVMe drives(3x 2.5-inch SSDs and 2x M.2) through PCIe bifurcation from CPU. In performance-maximizing RAID 0 configurations with dual M.2 SSDs, write speeds are up to 40% faster than a single M.2 SSD drive setup and read operations are an astonishing 84% faster. Or, for total reassurance, pair your M.2 devices into a RAID 1 configuration for instant data redundancy. NVMe high-speed storage interface P11C-M/10G-2T adopts the first-to-market NVMe technology to reduce latency, lower power consumption and provides faster CPU to data storage performance to gain larger throughputs. By offering flexible NVMe upgrade package of switching storage interface including PCIe to U.2 add-on card or M.2 to U.2 adapter, P11C-M/10G-2T features shared common backplane to improve drive choices. High bandwidth networking With built-in dual Intel 10G Base-T networking, P11C-M/10G-2T increases data throughput and improves datacenter efficiency — and that means more environmentally-friendly operation. You're able to build high-density, high-bandwidth and low-latency access-layer networks for your datacenter on a board. TPM-M 2.0 ready P11C-M/10G-2T supports TPM-M 2.0 with a 14-1 TPM header to securely store keys, digital certificates, passwords and data. It helps to enhance network security, protect digital identities, and ensure platform integrity. Comprehensive IT infrastructure management P11C-M/10G-2T features an optional embedded iKVM module and is bundled with ASUS Control Center to provide comprehensive out-of-band and in-band management features for small and mid-size businesses. The optional ASMB9-iKVM module supports remote BIOS updates, fan control, standalone KVMs, video recording, and BSOD capture, providing around-the-clock remote monitoring and diagnostics — even if the operating system is down or offline — through a user-friendly, web-based graphical interface that works with all major browsers. ASUS Control Center (ACC) is a centralized and integrated IT management platform for monitoring and controlling ASUS commercial products, including servers, workstations and digital signage. ACC enables remote BIOS updates, monitoring of multiple systems via mobile devices, and one-click software updates and dispatching, allowing easier server management for any IT infrastructure. Enhanced serviceability With its power button located on the front I/O panel, P11C-M/10G-2T is designed to provide easier maintenance and deployment for diverse applications. Quick initialization guidance P11C-M/10G-2T provides instant system information during initialization as well as any unusual diagnostic results for more efficient IT operation and easy troubleshooting. ASUS ProCool connector ASUS ProCool is designed without hollow area, this enables lower impedance, facilitates faster heat dissipation, resulting in cooler operating temperature. Reduces power loss and increases cost savings.